3D glass semiconductor project
Why In News?
On April 19, 2026, the foundation stone was laid for the unit at Info Valley, Bhubaneswar, Odisha, by Union Minister Ashwini Vaishnav and Odisha CM Mohan Charan Majhi.
The Technology: 3D Glass Substrate
Traditional chips use plastic (organic) or silicon bases. This project uses Glass, which offers:
- Thermal Stability: Glass manages heat better than organic materials, preventing warping in powerful AI processors.
- 3D Stacking: It uses 3D Heterogeneous Integration (3DHI), allowing diverse chiplets (logic, memory, sensors) to be stacked vertically for massive performance gains.
- Signal Integrity: Glass has lower electrical loss, enabling faster 5G/6G and AI data processing.
Investment & Economic Impact
- Total Outlay: Approximately ₹1,943 crore ($230+ million).
- Funding: Supported by ₹799 crore from the Central Government and ~₹400 crore from the Odisha State Government.
- Employment: Expected to create 2,500 direct and indirect jobs for engineering and ITI graduates.
- Partnership: Developed by 3D Glass Solutions (3DGS), a US-based leader, through its Indian arm HIPSPL.
Capacity & Timeline
- Annual Output: 70,000 glass panels and 50 million assembled units.
- Target Sectors: AI, Data Centres, 5G/6G, Defence, and Aerospace.
- Commercial Start: Production is scheduled to begin in August 2028, reaching full scale by 2030.
Strategic Significance
- Atmanirbhar Bharat: Reduces heavy reliance on imported advanced packaging from East Asia.
- Global Hub: Makes Odisha the first Indian state to host both a Compound Semiconductor Fab and a 3D Glass Packaging Unit.
- Tech Ecosystem: Aligned with the Kaynes Semicon efforts in Gujarat, this project completes a critical link in the domestic supply chain.
Download Pdf
